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Semi Book-to-Bill Ratio
November, 2014 (prelim.)   1.02
October, 2014                   0.93
September, 2014              0.94
August, 2014                   1.04
July, 2014                        1.07
June, 2014                        1.10
May, 2014                        1.00
April, 2014                       1.03
March, 2014                      1.06
February, 2014                   1.01
January, 2014                     1.04
December, 2013                  1.02
November, 2013                  1.11
October, 2013                      1.05
September, 2013                  0.97
August, 2013                      0.98
July, 2013                         1.00
June, 2013                         1.10
May, 2013                         1.08
April, 2013                        1.08
March, 2013                       1.11
February, 2013                    1.10
January, 2013                      1.11
December, 2012                   0.92
November, 2012                  0.79
October, 2012                      0.75
September, 2012                  0.78
August, 2012                       0.82
July, 2012                           0.86
June, 2012                          0.93
May, 2012                           1.05
April, 2012                           1.10
March, 2012                         1.12
February, 2012                     1.01
January, 2012                       0.96
December, 2011                    0.85
November, 2011                    0.83
October, 2011                      0.74
September, 2011                   0.71
August, 2011                       0.80
July, 2011                           0.85
June, 2011                           0.94
May, 2011                           0.97
April, 2011                        0.98
March, 2011                        0.95
February, 2011                     0.87
January, 2011                       0.85
December, 2010                   0.90
November, 2010                   0.97
October, 2010                      0.98
September, 2010                  1.03
August, 2010                      1.17
July, 2010                         1.23
June, 2010                        1.18
May, 2010                        1.13
April, 2010                        1.13
March, 2010                      1.21
February, 2010                   1.23
January, 2010                    1.23
December, 2009                 1.07
November, 2009               1.06
October, 2009                  1.09
September, 2009              1.17
August, 2009                  1.06
July, 2009                     1.06
June, 2009                      0.80
May, 2009                      0.73
April, 2009                    0.65
March, 2009                 0.56
February, 2009             0.49
January, 2009               0.47
December, 2008           0.86
November, 2008           0.97
October, 2008               0.96
September, 2008           0.70
August, 2008               0.81
July, 2008                     0.83
June, 2008                   0.81
May, 2008                   0.78
April, 2008                 0.82
March, 2008               0.87
February, 2008          0.92
January, 2008             0.89
December, 2007        0.85
November, 2007        0.82
October, 2007            0.80
September, 2007       0.79
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This Week's News

Featured News

TI Announces $25 C2000 Piccolo InstaSPIN-MOTION LaunchPad That Controls Three-Phase Motors

January 22, 2015 -- Texas Instruments (TI) today announced its C2000 Piccolo F2806x InstaSPIN-MOTION LaunchPad development kit for controlling three-phase motors. It provides a modular, quick-launch development tool containing everything needed — MCU, emulation and, for the first time, InstaSPIN-MOTION software — for engineers to easily and effectively design complete real-time motion control systems with optimized sensored or sensorless motion control. ... read more

Synopsys Expands Memory Verification IP Portfolio with UFS, UniPro and eMMC to Accelerate Verification Closure for Mobile Designs

January 21, 2015 -- Synopsys, Inc. today announced that its memory Verification IP (VIP) now includes key titles for the mobile industry. Synopsys memory VIP is based on a native SystemVerilog architecture to enable enhanced ease of use, integration and configurability. With these advanced features, project teams using the JEDEC UFS, MIPI UniPro and JEDEC eMMC protocols can further accelerate verification closure of mobile block, subsystem and system-on-chip (SoC) designs.

VIP for the emerging UFS and UniPro protocols also includes self-contained compliance test suites to accelerate verification closure and eliminate the tasks of developing a verification environment and tests. The test suites are delivered as native SystemVerilog source code for improved reuse, extensibility and debug. The JEDEC eMMC VIP includes support for eMMC Card and Host. All verification IP and test suites are based on a consistent SystemVerilog UVM architecture to enable easy adoption. ... read more

News since Thursday, January 15, 2015

Coilcraft Announces High-current, High-inductance Power Inductors Intended For Electric Vehicles

Linear Technology Announces Negative Input (-4.5V to -80V) Synchronous Buck-Boost/Inverting DC/DC Controller That Delivers up to 20-A Output Current

Vishay Intertechnology Announces 11 500-V High-Voltage MOSFETs Built on Gen II Super Junction Technology

API Technologies Releases Radiation Hardened Solid State Relays

Diodes Incorporated Announces 5mm x 6mm MOSFET H-bridges

Vishay Intertechnology Introduces BiAs Single-Line ESD 1.0 mm X 0.6 mm X 0.4 mm Protection Diode for Portable Electronics

ISSI Ramps Production of Automotive Grade Flash Products

IXYS Introduces 3165-A, 2.8kV Thyristors

Lattice Semiconductor Announces I/O Expansion and Bridging Starter Kit for Its MachXO3L FPGAs

Mentor Graphics Delivers Embedded Virtual Prototype Kits That Enable Unified HW-SW Debug and Analysis

Microchip Announces Controller That Enables One-step Design-in of 3D Gesture Recognition in Embedded Devices

STMicroelectronics Announces HDMI ESD Protection and Signal Conditioning for 4K Ultra-HD

Vishay Intertechnology PATT Precision Automotive Qualified Thin Film Chip Resistor Now Available in 0402 and 1206 Case Sizes

ams’ Announces Sensor-Integrated Smart Lighting Manager for IoT-Connected Daylight Harvesting

Intersil Announces Industry's Smallest Dual 3A/Single 6A Step-Down Power Module at 9.0mm x 6.5mm x 1.83mm

Microchip Announces Serial Quad I/O Memory Devices With 1.8V 15-mA Power and Industry's Fastest Erase Time of 35ms

TI Introduces N-channel power MOSFETs Featuring Industry's Lowest Resistance (Rdson) of 0.59-mOhms

Vitesse Announces Signal Conditioner Repeater IC Optimized For 8.5G PCIe Gen 3 Interconnects

Older News

Featured Newspaper & Magazine Articles

What? You don't have subscriptions to all of the leading trade publications? Well, there's no need to miss anything because you'll find most of the feature articles about analog design and DSPs indexed here.

Featured Online Articles

Envelope Tracking Makes CMOS PAs Possible in 4G Smartphones

December 11, 2014 -- In recent years, CMOS power amplifiers (PAs) have made significant inroads into the cost-sensitive GSM GPRS and 3G markets. While this has taken some market share away from traditional GaAs PAs, the fact remains that when it comes to high-end 3G and LTE applications, CMOS PAs continue to be limited in their performance and GaAs continues to dominate in these applications. In particular, the “soggy” compression characteristic of CMOS results in poor linearity, which is a key requirement for 4G waveforms with high peak-to-average power ratios (PAPR). ... read more

FPGA-based FSK/PSK Modulation

December 11, 2014 -- Binary FSK(Frequency Shift Keying) and PSK(Phase Shift keying) are extensively used in telecommunication for digital data transmission. FSK/PSK modulator circuits usually employ analogue components such as VCO (voltage control oscillator), RF Mixer, and Level-shifter, with limited frequency range and whose performance drifts with variation in environmental temperature and duty cycle. An FPGA-based all-digital implementation ensures constant optimum performance and reconfigurability. ... read more

Sensor Fusion Enhances Device Performance

December 10, 2014 -- With the ongoing revolution in powerful and intelligent device development such as smart phones, new applications are being enabled at a rapid pace and system development often fails to keep up with new and changing requirements. Today, new applications such as indoor navigation and augmented reality, which make use of motion or positional data, require users to accept a somewhat crude sensor fusion implementations originally developed for simple gaming applications. Now, however, end users easily notice the considerable shortcomings and inaccuracies of the implementations. ... read more

Online since Tuesday, December 23, 2014

More Online Articles

Featured Webinars

How to Enable Seamless Connectivity with USB Solutions

February 19, 2015, 2:00 p.m. EST -- USB Type-C is a new Connector Standard billed as the ‘Last Connector’, that will allow multi-function signaling (e.g. USB, Display Port, etc.) to pass over a small form factor, compact, high reliability connector. NXP’s offers a broad portfolio of best-in-class solutions for this emerging market, including USB-Power Delivery, X-Bar Switches, Microcontrollers, Authentication, AC/DC adapter components and Load Switches and ESD/EMI solutions. This webinar will give an overview of the Type-C interface and NXP solutions.

Speaker: Ravi S. Shah. Product Applications Engineer, Regional Marketing, Secure Interface and Power, Strategic Marketing Manger for IoT, Synopsys.

Registration required.

learn more

All Webcasts

Recommended Tutorials & White Papers

Understanding Automotive Reliability and ISO 26262 for Safety Critical Systems

November 24, 2014 -- Automotive electronics play a critical role in today's automotive safety systems. While standards like ISO 26262 provide a framework for robust and reliable design and verification practices, it can be challenging to comply with these standards throughout the entire design process. A new class of IC reliability verification tool is helping designers ensure their designs satisfy these demanding safety and performance standards.

By Matthew Hogan, Mentor Graphics. ... read more

Ensuring Interoperability in Internet of Things (IoT)

November 10, 2014 -- The presence of multiple communication technologies and wide variety of protocol implementation makes interoperability a big challenge in the IoT ecosystem. Original Equipment Manufacturers (OEMs) need to develop highly interoperable products and solutions to ensure success in the IoT market. ... read more

More Tutorials, White Papers, etc.

Upcoming Conferences & Seminars

IEEE International Solid-State Circuits Conference (ISSCC), "60 Years of (Em)Powering the Future," February 12-26, 2015, San Francisco Marriott.

ISSCC is the flagship conference of the Solid-State Circuits Society. The Conference offers a unique opportunity to network with leading experts in the field. ... read more

Mobile World Congress, March 2-5. 2015, Barcelona, Spain -- The mobile communications revolution is driving the world’s major technology breakthroughs. From wearable devices to connected cars and homes, mobile technology is at the heart of worldwide innovation. As an industry, we are connecting billions of people to the transformative power of the Internet and mobilizing every device we use in our daily lives. ... read more

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