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Featured News

STMicroelectronics Announces Microprocessors for High-Performance Connectivity and Embedded Applications

July 29, 2010 -- STMicroelectronics today introduced the industry's first embedded microprocessor that couples two ARM Cortex-A9 cores with a DDR3 (Third-generation double-data rate) memory interface. Manufactured in ST's low-power 55nm HCMOS (high-speed CMOS) process technology, the SPEAr1310 delivers high computing power and customizability for multiple embedded applications together with the high level of cost competitiveness offered by system-on-chip devices.

The new microprocessor combines the unrivalled low power and multi-processing capabilities of the ARM Cortex-A9 processor core with innovative Network-on-Chip (NoC) technology. The dual ARM Cortex-A9 processors support both fully symmetric and asymmetric operations, at speeds of 600MHz/core (industrial worst-case conditions) for 3000 DMIPS equivalent. NoC is a flexible communications architecture that enables multiple different traffic profiles while maximizing data throughput in the most performance- and power-efficient way. ... read more

News since Thursday, July 22, 2010

IR Expands Its Family of Automotive-Qualified MOSFETs Featuring Low On-State Resistance

Microsemi Announces Its Highest Power SiC RF Power Device for UHF Radar Applications

Supertex Introduces Off-Line, Scalable Output, Inductorless Switching Regulator

Vishay Announces 140 CRH and 150 CRZ Series Surface-Mount Aluminum Capacitors That Meet IPC/JEDEC J-STD-020 Soldering Guidelines

Wolfson Announces 6.99mW Low Power Audio Hub for Portable Digital Audio Applications

National Semiconductor Introduces Industry's First Analog Audio Subsystem With Integrated Noise Reduction

Rambus Introduces High-Performance DDR3 Memory Controller Interface for Consumer Electronics

Synopsys Announces that It is Industry's First to Deliver High-Performance Audio IP in 40-nm and 55-nm Process Technologies

Actel Announces New FlashPro4 Programmer

Analog Devices Simplifies Wireless Infrastructure System Design with Mixed-Signal, Digital Pre-Distortion Development Platform Using Xilinx FPGAs

C6EZFlo DSP Software Development Tool from Texas Instruments Generates Prototyping Code Using a Graphical Interface

Diodes Incorporated Extends Logic Family with Open Drain Parts

Fairchild Semiconductor's Global Power Resource Center Announces Complete Energy-Efficient LED Street Lighting

High-Speed NXP Switch Is Industry's First to Support USB 3.0, PCIe Gen3 and 6 Gbps SATA/SAS

Intel Milestone Confirms Light Beams Can Replace Electronic Signals for Future Computers

Low-Power (45µA), Small Form Factor (SOIC) Op Amps from Microchip Help Extend Battery Life

LSI Expands 6Gb/s SAS Family with New High Port Count Storage Adapters

Micron Introduces 2GB, DDR2 Memory Device Supporting Intel Processor-Based Tablets and Netbooks

Microsemi and Spelsberg Create Strategic Alliance for Disruptive Solar Bypass Technology With Higher Reliability, Lower Power Dissipation

QuickLogic Announces Framebuffer to Extend Battery Life

Virage Logic Broadens Semiconductor IP Offering with Portfolio of SoC Infrastructure Solutions

Virage Logic Expands Semiconductor IP Portfolio with Silicon-Proven SiANA Analog IP Offering

Virage Logic's ARC Sound AS221BD Dual-Core Processor Targets Blu-ray Audio

Xilinx Improves Design Flow for Industry's Only Proven Partial Reconfiguration FPGA Technology with ISE Design Suite 12.2

AMD Unlocks 3D Internet Potential with Industry's First OpenGL ES 2.0 Driver

IDT Introduces Intelligent System Power Management IC

Khronos Drives Rapid Evolution of Cross-Platform 3D Graphics with Release of OpenGL 4.1 Specification

Maxim Announces the MAX2180 LNA, Which Integrates an AGC Circuit to Optimize Car Antenna Reception While Reducing Size and Cost

Mentor Graphics Collaboration With National Instruments Speeds Time to Market With Faster Test Bench Development

MosChip Launches Four Multi-Function PCI Express Controller Chips

NetLogic Microsystems Announces Multi-Core Processor Which Integrates 128 nxCPUs to Deliver 160 Gbps Throughput

NXP Acquires Jennic for $12.2 Million Cash to Extend Leadership in Low Power RF for Wireless Applications

Ramtron Begins Commercial Sampling of MaxArias Wireless Memory

Vishay Siliconix Announces Industry's Smallest (0.64-mm Sq.) and Thinnest (0.357mm) N-Channel Chipscale Power MOSFET

MoSys Tapes out Bandwidth Engine IC for Next Generation Networking Applications

For more than three decades, Intel has developed technology enabling the computer and Internet revolution that has changed the world. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971. Today, Intel supplies the computing and communications industries with chips, boards, systems, and software building blocks that are the "ingredients" of computers, servers and networking and communications products. ... learn more Vendor Directory

Recommended Tutorials & White Papers

Multicore Processors Bring Innovation to Medical Imaging June 1, 2010 -- Imaging systems based on either a hardwired, non-programmable processor or on a specialized graphics processor cannot match the flexibility, scalability and power efficiency required by the next generation of portable medical imaging equipment. In contrast, multicore digital signal processors (DSPs) – whether a heterogeneous system-on-chip (SoC) with a DSP core and general-purpose processor (GPP) or a homogenous SoC with multiple, similar DSP cores – bring the best of both worlds to bear on the challenges of medical imaging. Emerging medical imaging systems are in turn begetting exciting new diagnostic procedures and treatments that continue to improve the quality of medical care. ... read more More Tutorials, White Papers, etc.

Upcoming Conferences & Seminars

4G World, September 18-21, 2010, McCormack Place, Chicago, IL -- 4G World Conference & Expo is dedicated to providing a balanced view of where WiMAX stands today and what role it will play in the future of what is one of the fastest growing market segments in the world, wireless and mobile broadband. The event incorporates all of today's converging and diverging issues surrounding WiMAX and mobile broadband. ... read more More Conference and Seminar Listings