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Featured News

National Semiconductor Introduces Industry's First Quad Multipoint-LVDS Transceiver

May 8, 2008 -- National Semiconductor Corp. today introduced the industry's first quad multipoint-low-voltage differential signaling (M-LVDS) transceiver designed for backplane clock distribution in Advanced Telecom and Computing Architecture (ATCA) and MicroTCA line cards. The new quad-channel transceiver is compliant with the EIA/TIA-899 M-LVDS standard. It provides the optimum balance of integration and ease of design to reduce board space and design time in end equipment such as wireless base stations, communications routers and LXI test instruments. ... read more

News since Thursday, May 01, 2008

IR Introduces Family of MOSFETs in Robust TO-247 Package

IXYS Introduces TrenchMV Power MOSFETs In An Isolated Power Module In A Six-Pack Configuration

Maxim Unveils Multirate, Lock and Data Recovery (CDR) 2.488 Gbps Serializer/Deserializer

Mistral Offers High Performance OpenGL

STMicroelectronics Cuts Power to <1mA and Response Time with New Touch Screen Controller IC

Cypress Unveils Free Online Solutions Library for PSoC Designs

DMP Slashes Power 50% in New 3-D Graphics Processor IP Core ''PICA200'' by using Sequence PowerTheater

NASA, Intel, SGI Plan to 'Soup Up' Supercomputer

Spreadtrum Announces SC6600V: Industry's First Single-Chip Demodulator/Decoder for CMMB-Based Mobile TV

Sprint and Clearwire to Combine WIMAX Businesses, Creating a New Mobile Broadband Company

STMicroelectronics and Mobileye Deliver Second-Generation SoC for Vision-Based Driver Assistance Systems

TI Announces Remote-Controlled LED Board

Atmel Introduces AVR USB 2.4GHz Wireless Reference Design for Battery-Based PC Peripherals

FreeRange Technologies Announces USB Peripheral Stack to Bring Wired and Wireless Connectivity to Embedded Devices

Maple 12 Delivers Major Innovations in Engineering Analysis and Design

Microsemi Announces 1.7KW Class D Amplifier RF Generator Reference Design Kit

Nvidia Helps PC Users Go Green With Hybrid SLI

Semtech DSL TVS Device Protects Sensitive DSL Line Drivers

STMicroelectronics Unveils Low 0.060 Ohm On-Resistance Fast-Recovery MOSFET Switches

TI Introduces Class-D Audio Amplifier with Integrated Boost Converter to Drive 1.5-W Constant Output Power

Analog Devices MEMS-Based Vibration Sensor Helps Keep Factory Equipment On-Line

Avago Technologies Announces Industry's Thinnest Autofocus LED for Use in Digital Still Cameras and Camera Phones

Bookham Acquires Laser Controller Product Line from Precision Photonics Corporation for New Focus Product Line

GE Fanuc Intelligent Platforms Announces SBC320 3U VPX SBC Optimized For Demanding Space-Constrained Embedded Applications

Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition

Maxim Unveils High-Frequency Crystal Oscillators that Provide ±5% Frequency Margining and <1psRMS Low-Jitter Performance

Microchip Technology Announces Serial EEPROM Family On New Single I/O Bus

Micronas Introduces Hall-Effect Sensors With PWM and SENT Interfaces Enabling Reliable Data Transfer in Harsh Automotive Environments

New Release of Lattice FPGA Design Tools Includes Industry's First SSO Analyzer for SERDES Design

ON Semiconductor Releases New PureEdge High Performance Single and Dual Frequency Crystal Oscillator Modules

Qwest to Deliver Verizon Wireless Products and Services to Its Customers

Silicon Laboratories Introduces Industry's Highest Integration Isolated Gate Driver

STMicroelectronics Cuts Capacitance and Footprint for USB 2.0 ESD Protection

TI's Ultra-Thin Chip Module Enables Production of High-Quality Graphics-Rich Branded Contactless Cards

T-Mobile USA Begins Commercial 3G Network Rollout in New York City

T-Mobile and Nokia Collaborate on Mobile Services and Personal Social Networks

For more than three decades, Intel has developed technology enabling the computer and Internet revolution that has changed the world. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971. Today, Intel supplies the computing and communications industries with chips, boards, systems, and software building blocks that are the "ingredients" of computers, servers and networking and communications products. ... learn more Vendor Directory

Recommended Tutorials & White Papers

Increase Performance in Imaging Applications by Integrating DSP Functions With FPGAs March 1, 2008 -- Intevac is a leading developer of photonics products for commercial and military markets. This white paper describes the development of the embedded electronic systems for their NightVista product, a compact, high-performance, ultra low-light camera. The initial implementation of this camera was based on a popular digital signal processor, several ASSPs, and external memory devices. The requirement to increase system performance led the engineering team to explore an alternative based on a configurable soft-core processor implemented in programmable logic. ... read more More Tutorials, White Papers, etc.

Upcoming Conferences & Seminars

Design Automation Conference (DAC), June 8 - June 12, 2008, Anaheim Convention Center, Anaheim -- is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers. ... read more TechConnect Summit 2008, June 3-5, 2008, Hynes Convention Center, Boston, MA -- The annual TechConnect Summit is the world’s largest peer-vetted deal flow for technology Partnering, Investing and Licensing. The Summit is unique in that it brings together annually the world’s top technology transfer offices, companies, and investment firms to locate the most promising technologies and early stage companies from around the world. ... read more More Conference and Seminar Listings