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Semi Book-to-Bill Ratio
February, 2014 (prelim.)       1.00
January, 2014                     1.04
December, 2013                  1.02
November, 2013                  1.11
October, 2013                      1.05
September, 2013                  0.97
August, 2013                      0.98
July, 2013                         1.00
June, 2013                         1.10
May, 2013                         1.08
April, 2013                        1.08
March, 2013                       1.11
February, 2013                    1.10
January, 2013                      1.11
December, 2012                   0.92
November, 2012                  0.79
October, 2012                      0.75
September, 2012                  0.78
August, 2012                       0.82
July, 2012                           0.86
June, 2012                          0.93
May, 2012                           1.05
April, 2012                           1.10
March, 2012                         1.12
February, 2012                     1.01
January, 2012                       0.96
December, 2011                    0.85
November, 2011                    0.83
October, 2011                      0.74
September, 2011                   0.71
August, 2011                       0.80
July, 2011                           0.85
June, 2011                           0.94
May, 2011                           0.97
April, 2011                        0.98
March, 2011                        0.95
February, 2011                     0.87
January, 2011                       0.85
December, 2010                   0.90
November, 2010                   0.97
October, 2010                      0.98
September, 2010                  1.03
August, 2010                      1.17
July, 2010                         1.23
June, 2010                        1.18
May, 2010                        1.13
April, 2010                        1.13
March, 2010                      1.21
February, 2010                   1.23
January, 2010                    1.23
December, 2009                 1.07
November, 2009               1.06
October, 2009                  1.09
September, 2009              1.17
August, 2009                  1.06
July, 2009                     1.06
June, 2009                      0.80
May, 2009                      0.73
April, 2009                    0.65
March, 2009                 0.56
February, 2009             0.49
January, 2009               0.47
December, 2008           0.86
November, 2008           0.97
October, 2008               0.96
September, 2008           0.70
August, 2008               0.81
July, 2008                     0.83
June, 2008                   0.81
May, 2008                   0.78
April, 2008                 0.82
March, 2008               0.87
February, 2008          0.92
January, 2008             0.89
December, 2007        0.85
November, 2007        0.82
October, 2007            0.80
September, 2007       0.79
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Welcome to ANALOGandDSP, your first stop when you're looking for information about analog design, analog design tools, digital signal processing (DSP) hardware software and tools, FPGAs/CPLDs, SoCs, mixed-signal design, digital design, ASIC design, and engineering jobs. If you're a first-time visitor, we suggest that you go to About ANALOGandDSP for a complete description of the site and everything you'll find here.

This Week's News

Featured News

Samsung and GLOBALFOUNDRIES Announce Strategic Collaboration to Deliver Multi-­Sourced Offering of 14nm FinFET Semiconductor Technology

April 17, 2014 -- Samsung Electronics Co., Ltd. and GLOBALFOUNDRIES today announced a new strategic collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology. For the first time, the industry’s most advanced 14nm FinFET technology will be available at both Samsung and GLOBALFOUNDRIES, giving customers the assurance of supply that can only come from true design compatibility at multiple sources across the globe. The new collaboration will leverage the companies’ worldwide leading-­‐edge semiconductor manufacturing capabilities, with volume production at Samsung’s fabs in Hwaseong, Korea and Austin, Texas, as well as GLOBALFOUNDRIES’ fab in Saratoga, New York. ... read more

Zebra Technologies to Acquire Enterprise Business from Motorola Solutions for $3.45 Billion Cash

April 15, 2014 -- Zebra Technologies Corporation and Motorola Solutions, Inc. today announced that they have entered into a definitive agreement in which Zebra will acquire Motorola’s Enterprise business for $3.45 billion in an all-cash transaction. The acquisition will be funded through a combination of cash on hand and new debt. The transaction, which was approved by the Boards of Directors of both companies, is subject to customary closing conditions including regulatory approvals. The transaction is expected to be completed by the end of 2014. ... read more

News since Friday, April 11, 2014

IXYS Introduces RFID ICs

Efficient Power Conversion (EPC) Introduces Development Board for 25-A Current, High Step-Down Buck Converter Applications

IR Introduces 60V MOSFETs Featuring 2-mOhm Rds(on) for Industrial Applications

Linear Technology Announces 17V, 2.25MHz, Synchronous Step-Down Regulator That Delivers 2A and Requires Only 3.5µA of Quiescent Current

Vishay Intertechnology Releases 12-W, +350°C Non-Magnetic, Non-Inductive Axial Lead Wirewound Resistors

On Semiconductor Announces ESD Protection Devices Featuring Industry's Lowest Capacitance (0.35 pF) and Industry's Lowest Clamping Voltage (8V at 16A)

QuickLogic Announces IrDA-Based TV Remote Control PSB for Mobile Devices

TI Introduces Vision Software Development Kit, Embedded Vision Engine and DSP Libraries for ADAS

Vishay Intertechnology Introduces Metallized Polypropylene Film DC-Link Capacitor

Xilinx Releases Vivado Design Suite 2014.1 with Support for 20nm Devices and OpenCL Hardware Acceleration

National Instruments Introduces USRP RIO SDR Wireless Prototyping Platform

Broadcom Doubles Wi-Fi Speed to 3.2 Gbps with Industry's First Six-Stream 802.11ac MIMO Platform

IXYS Introduces PIM-Mini 5A to 200A Miniature Pulsed Laser Diode Driver

IDT Introduces Ultra-Compact Wireless Power Receivers Offering 70% Footprint Reduction

Microchip Announces Industry's First 1.5-A Three-Phase Brushless DC Sinusoidal Motor Driver in a 4x4-mm Package with AEC-Q100 Quality Certification

Microchip Unveils 4Kb Serial Presence Detect EEPROM for DDR4 SDRAM Modules

On Semiconductor Announces CMOS 1.3-MP Image Sensors for Industrial Applications

Older News

Featured Newspaper & Magazine Articles

What? You don't have subscriptions to all of the leading trade publications? Well, there's no need to miss anything because you'll find most of the feature articles about analog design and DSPs indexed here.

Featured Online Articles

The IoT Requires A New Type Of Low-Power Processor

April 17, 2014 -- Every chip and OEM device manufacturer now building components and solutions for the Internet of Things, especially wearable and battery-powered devices, faces a performance and power paradox challenge that is driving the need for a new type of low-power processor. ... read more

Product How-to: Sophisticated Tools Accelerate SDR Exploration

April 8, 2014 -- Software-defined radio (SDR) is an increasingly viable and important communications system. In principle, it allows a single hardware design to support communications across a variety of formats, protocols, and frequencies, including GSM base stations, LTE base stations, MIMO designs, and more. ... read more

Leakage Power Optimization for 28nm and Beyond

April 7, 2014 -- As process nodes shrink towards nanotechnology, the supply voltage is scaled down to protect the device from excessive electric field across the gate oxide and the conducting channel. Another reason for supply voltage reduction is to save dynamic power dissipation. On the flip side, this voltage reduction slows down the CMOS transistor.

To overcome this performance loss, the transistors’ threshold voltage is decreased, which increases sub-threshold leakage current. At these nodes, leakage power can contribute more than 50% of the overall chip power – hence, high performance chips have excess power dissipation, even in standby mode. Increasing performance causes more leakage power dissipation. ... read more

Online since Wednesday, March 19, 2014

Bitcoin: A Technological and Economic Game Changer?

Exploring the Acceptability of Google Glass as an Everyday Assistive Device for People with Parkinson’s

Minimize Crosstalk with Optimized PCB Routing Technique

Simplify DC-DC Converter Characterization

Powering Image Sensors in Automotive Camera Applications

Parity–time-Symmetric Whispering-Gallery Microcavities

More Online Articles

Featured Webinars
The Future of Embedded Systems

May 1, 2014, 2:00 p.m. EDT -- The world is changing fast. The pace of technological advancement increases every year, and the interconnected nature of today's products—part of the Internet of Things—has introduced greater complexities, inherent security vulnerabilities, and ever-increasing risk to successful project development and deployment. Further complicating projects are cost and time pressures as companies working with reduced budgets seek to minimize development costs and compress time-to-market schedules.

Recent research from UBM has shown that 55% of new designs are behind schedule by an average of 5 months. There's widespread pent-up demand for better solutions, more training, and updated methods to shorten embedded development schedules. In fact, by a large majority, developers agree that further investment in commercial tools, operating systems, services and support will increase development efficiency significantly.

Join this exclusive panel Webcast for a round-table discussion from industry experts from VDC, Intel, and Wind River on how embedded development is transforming and how you can be an agent of change for the future.

  • Hear from industry experts on their opinions on the current state of embedded development and where the future lies.
  • Exciting new data, directly from embedded engineers like you, on how they see the present and future of embedded development.
  • How the whole is more than the sum of its parts – a solution approach is leading the transformation of how embedded development teams acquire and adopt new technology.

Jim McLeod-Warrick, Managing Partner, Beacon Technology Partners LLC

Jay Andersen, VP of Professional Services, Wind River

Registration required.

learn more

All Webcasts

Recommended Tutorials & White Papers

Designing the Next Generation of Industrial Drive and Control Systems

April 1, 2014 -- A typical industrial system requires control, application and connectivity capabilities. The control subsystem directly manages motor operation and feedback, the application directs the overall motion, and the connectivity subsystem downloads application, control data and allows the system to be remotely managed. ... read more

More Tutorials, White Papers, etc.

Upcoming Conferences & Seminars

The Real-Time & Embedded Computing Conference (RTECC), April 29, 2014, 8:30 a.m. - 3:30 p.m. EDT, Sheraton Framingham Hotel, 1657 Worcester Road Framingham, MA is a unique event dedicated to bringing up-to-date and in-demand information about the real-time and embedded computing world to the doorstep of your customers and prospects. ... read more

More Conference and Seminar Listings

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